Intel’s interim co-CEO ‘wants’ these qualities in the next company chief executive

Intel's interim co-CEO David Zinsner highlighted the need for manufacturing and product expertise in the next CEO. The company is reportedly considering former board member Lip-Bu Tan. Zinsner reaffirmed Intel's commitment to its turnaround plan and existing financial outlook, emphasizing the importance of a cultural shift for success in the foundry and semiconductor markets.
Intel’s interim co-CEO ‘wants’ these qualities in the next company chief executive
Intel's interim co-CEO David Zinsner has revealed the qualities that the company is looking for in its next chief executive. According to a report, the company is prioritising manufacturing and product experience in its search for a new chief executive officer.
This announcement comes after the recent ousting of CEO Pat Gelsinger and amidst reports that Intel is considering former board member Lip-Bu Tan as a potential successor.
According to a report by news agency Reuters, Zinsner said at the UBS technology conference that the next CEO will ideally possess expertise in both foundry operations and product development. He emphasised that Intel's core strategy remains unchanged and that the company is committed to its turnaround plan.
“I'm not in the process, but I'm guessing that the CEO will have ... both some capability around foundry as well as on the product side,” Zinsner said.

‘No change in company business forecast’


Zinsner also reaffirmed the financial outlook provided in October, expressing optimism about the future of Intel’s PC and server business.
Naga Chandrasekaran, Intel’s head of foundry manufacturing and supply chain, said that there’s a need for a significant cultural shift within the company to succeed in both the foundry and semiconductor markets.
Despite these challenges, Intel remains focused on its advanced manufacturing processes. Chandrasekaran stated that the development of the 18A node is progressing as expected.

“There's nothing fundamentally challenging on this node now. It is about going through the remaining yield challenges, defect density challenges,” he said.
Intel plans to provide samples of chips made with the 18A node to customers in the first half of next year and begin mass production at its Oregon plant in the second half.
Zinsner also expects the foundry business to achieve better margins next year, driven by the production of Lunar Lake processors and cost reductions.
author
About the Author
TOI Tech Desk

The TOI Tech Desk is a dedicated team of journalists committed to delivering the latest and most relevant news from the world of technology to readers of The Times of India. TOI Tech Desk’s news coverage spans a wide spectrum across gadget launches, gadget reviews, trends, in-depth analysis, exclusive reports and breaking stories that impact technology and the digital universe. Be it how-tos or the latest happenings in AI, cybersecurity, personal gadgets, platforms like WhatsApp, Instagram, Facebook and more; TOI Tech Desk brings the news with accuracy and authenticity.

End of Article

Latest Mobiles

FOLLOW US ON SOCIAL MEDIA