MediaTek introduces Dimensity 9400+ chipset for improved AI performance in flagship smartphones

TOI Tech Desk / TIMESOFINDIA.COM / Apr 11, 2025, 01:15 IST

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MediaTek has unveiled its latest flagship processor, the Dimensity 9400+ SoC, designed to elevate AI performance in high-end smartphones. This chipset boasts advanced generative and agentic AI capabilities, supporting the latest large language models while maintaining power efficiency. Key components include an all Big Core CPU design, the MediaTek NPU 890, and a 12-core Arm Immortalis-G925 GPU.

MediaTek introduces Dimensity 9400+ chipset for improved AI performance in flagship smartphones

MediaTek has announced its latest flagship processor, the Dimensity 9400+ SoC. This new chipset is designed to boost AI performance in high-end smartphones. The company claims that the chipset will offer advanced generative and agentic AI capabilities, which will enable support for the latest large language models without compromising power efficiency. Developed as the latest member of MediaTek’s Dimensity family, the Dimensity 9400+ brings significant performance enhancements to meet the demanding computational needs of the latest mobile apps. The company has also confirmed that the first smartphones powered by the MediaTek Dimensity 9400+ will be available in the market this month.

MediaTek Dimensity 9400+ chipset: Key components

Here are all the details about the key components of the new MediaTek Dimensity 9400+ chipset:

Key Components	Specifications
CPU	All Big Core design: 1 x Arm Cortex-X925 core (up to 3.73GHz), 3 x Cortex-X4 cores, 4 x Cortex-A720 cores
NPU	MediaTek NPU 890; supports Mixture-of-Experts (MoE), Multi-Head Latent Attention (MLA), Multi-Token Prediction (MTP), and FP8 inferencing; 20% faster agentic AI performance with Speculative Decoding+ (SpD+); includes Dimensity Agentic AI Engine (DAE)
GPU	12-core Arm Immortalis-G925 GPU with opacity micromap (OMM) support; includes MFRC 2.0+ to double effective FPS and improve power efficiency by up to 40%
Imaging	MediaTek Imagiq 1090 for HDR video recording across the full zoom range; includes Smooth Zoom technology
Bluetooth	Direct phone-to-phone connection ranges up to 10 km
Satellite	BeiDou support with 33% faster Time to First Fix (TTFF) without cellular connectivity
Wi-Fi	Wi-Fi 7 tri-band concurrency with five streams; MediaTek Xtra Range™ 3.0 for up to 30 m greater coverage
SIM	5G/4G Dual SIM Dual Active, Dual Data capability

Commenting on the announcement, JC Hsu, senior VP at MediaTek said: “The MediaTek Dimensity 9400+ will make it easier to deliver innovative, personalized AI experiences on-device, combined with enhanced overall performance to ensure your device can handle all tasks with ease,” said “We are working closely with developers and manufacturers to continue building a robust ecosystem of AI applications and other features that will bring a number of speed and privacy benefits to consumers.”

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TOI Tech Desk

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