Taiwan Semiconductor Manufacturing Company (TSMC) has announced a significant expansion of its investment in advanced semiconductor manufacturing in the US. Building on its existing $65 billion investment in Phoenix, Arizona, TSMC plans to pour an additional $100 billion into US operations, bringing the total investment to a record-breaking $165 billion.
The leading chipmaker said that the expansion will include three new fabrication plants, two advanced packaging facilities and a major R&D center in Arizona, making it the largest single foreign direct investment in US history.
“Back in 2020, thanks to President Trump’s vision and support, we embarked on our journey of establishing advanced chip manufacturing in the US. This vision is now a reality,” said TSMC Chairman and CEO Dr. C.C. Wei.
“AI is reshaping our daily lives and semiconductor technology is the foundation for new capabilities and applications. With the success of our first fab in Arizona, along with needed government support and strong customer partnerships, we intend to expand our US semiconductor manufacturing investment by an additional $100 billion, bringing our total planned investment to $165 billion,” he added.
The expansion is projected to create 40,000 construction jobs over the next four years and tens of thousands of high-paying, high-tech jobs in advanced chip manufacturing and R&D. It is also estimated to generate over $200 billion in indirect economic output in Arizona and across the United States over the next decade.
Taiwan to keep most advanced chip technology at home
Meanwhile, Taiwan government has said that while it will assist TSMC with its future investments in the US, it will keep the most advanced semiconductor technology at home.
Taiwan's cabinet spokesperson has also said that the government will take into account TSMC's development and Taiwan's position in the global chips industry when reviewing the chip foundry's investment plans in the US.